Product Features

  • MJ interposer Middle Frame BGA Reballing middle-level layer board.

  • Apply to XS XS-MAX mode phone during maintenance.

  • Can be used MJ interposer Middle Frame for replacement.

  • Separate maintenance, for the operation is wrong to middle frame made the damage.

  • Note:Need to be dismantled upper and lower motherboards separate maintenance.

Product Specification

  • Application:for iPhone XS MAX middle-level layer separate board

  • Weight: 0.01kg

  • Color: Metal

  • Function: BGA reballing double-stacked logic board upper lower layers board frame.

Post Your Needs Information

10PCS Mijing Interposer Middle Board X Middle Frame Board X Middle Frame X Upper And Lower Connecting Board XS XSMAX

Brand: Oriwhiz Replace Parts

Availability:50 pieces remain(Low stock) will be shipped within 24 hours

Product Code: 20018145

Leadtime: Find estimated receipt time in the shopping cart

$35.33 35.33

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